Welcome to the new website for Hardy Process Solutions.
Click here to share your feedbackEasy Connection on the Backplane or Over Wire Coupled with AOPs, Faceplates/AOIs Reduce Systems Integration Time Up to 90%
SAN DIEGO, CA – June 2, 2016 – Hardy Process Solutions has achieved the highest level of weighing integration with Rockwell Automation® Logix® systems, with a combination of connectivity on the backplane or over wire and integration tools. Using a combination of Add-on-Profiles (AOPs), EDSAOPs, HMI Faceplates with Add-on-Instructions, and sample programs/function blocks creates a synergistic methodology for EASY and seamless integration for weighing with Rockwell PLCs and PACs using RSLogix® and Studio 5000®.
